Poly(3,3′,4,4′-benzophenonetetracarboxylic dianhydride-co-4,4′-oxydianiline/1,3-phenylenediamine), amic acid solution
Poly(3,3′,4,4′-benzophenonetetracarboxylic dianhydride-co-4,4′-oxydianiline/1,3-phenylenediamine), amic acid solution (CAS: 31942-21-9) is a specialised polymer solution. This high-performance material finds application as a dielectric component in advanced electronic systems. Its unique properties make it suitable for thin films, high-density interconnects, and multichip modules, particularly within the semi-conductor industry.
- Synonyms
- 4′-benzophenonetetracarboxylic dianhydride-co-4,4′-oxydianiline/1,3-phenylenediamine), amic acid solution
Semi-conductor Material
This polyamic acid solution serves as a critical material in the semi-conductor industry. It is utilised for its dielectric properties in various advanced electronic components.
Dielectric Films
The solution is employed in the fabrication of dielectric layers essential for insulating conductive elements in electronic devices. This includes applications in thin films.
High-Density Interconnects
It functions as a key component in the manufacturing of high-density interconnect (HDI) systems, enabling denser and more efficient circuit designs.
Multichip Modules
This material is integral to the construction of multichip modules (MCMs), where multiple integrated circuits are interconnected on a substrate.
| Boiling point | 159 °C(lit.) |
|---|---|
| Density | 1.06 g/mL at 25 °C(lit.) |
| Refractive index | n20/D 1.517(lit.) |
| Concentration | 19 wt. %±1 wt. % (1-methyl-2-pyrrolidinone/aromatic hydrocarbon (80:20)) |
| Storage temperature | −20°C |
| Impurities tested | ≤10 ppm total metals |
| Application | Semi-conductor material. Dielectric component in thin films, high density interconnect systems and multichip modules. |
| Transport (UN / ADR) | UN 1866 3/PG 3 |
|---|---|
| Water hazard class (WGK, DE) | 3 |
| Anion traces | chloride (Cl-): ≤5 ppm |
Hazard information is provided for guidance. Always consult the product Safety Data Sheet (SDS), available on request, before handling.
| Transition Temp | Tg >320 °C (imide) |
|---|---|
| Purified By | filtration through 0.2μm medium |
Documentation
Every batch ships with a Certificate of Analysis covering assay, identity and purity; the grade is confirmed against your enquiry. Safety Data Sheets and technical data sheets are available on request.
Supply & logistics
Samples for technical evaluation; bulk MOQ by grade and packaging. In-stock material ships in 7–10 working days, worldwide, with full export documentation.
What is Poly(3,3′,4,4′-benzophenonetetracarboxylic dianhydride-co-4,4′-oxydianiline/1,3-phenylenediamine), amic acid solution used for?
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This polyamic acid solution is primarily used as a semi-conductor material and a dielectric component in thin films, high-density interconnect systems, and multichip modules.
What are the CAS number and formula for this product?
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The CAS number is 31942-21-9. The formula is provided as '4'.
What grade and purity does Tech Serve Solutions supply?
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Tech Serve Solutions supplies this product at a concentration of 19 wt. %±1 wt. % in a 1-methyl-2-pyrrolidinone/aromatic hydrocarbon (80:20) solvent, purified by filtration through 0.2μm medium, with ≤10 ppm total metals and ≤5 ppm chloride (Cl-) as impurities. We do not represent this product as USP, BP, EP, or other pharmacopoeia grades.
How should this chemical be handled and stored?
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This product is classified with a WGK (Germany) of 3. It requires storage at -20°C. Please consult the Safety Data Sheet (SDS) for comprehensive handling and safety information.
Is this product shipped internationally?
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Yes, Tech Serve Solutions is a global supplier and exporter of fine chemicals, including this product. It is shipped under UN 1866, Class 3, Packing Group 3.
How can I request a sample or quote?
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To request a sample or a quotation, please contact our sales team through the website or by direct enquiry, providing the product name and CAS number (31942-21-9).
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