Negative photoresist I

CAS 9003-31-0Micro / NanoElectronics

Negative photoresist I (CAS: 9003-31-0) is a specialized chemical compound utilised in micro- and nanoelectronics fabrication. It is a negative-acting photoresist, meaning that the areas exposed to light become insoluble in the developer solution. This property allows for precise pattern transfer onto substrates. Its applications include photolithography processes for creating intricate microelectronic circuits and devices. Storage at 2-8°C is recommended to maintain its properties.

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Negative photoresist I — chemical structure, CAS 9003-31-0; Materials Science, fine chemical supplied by Tech Serve Solutions

Materials ScienceMicro/NanoElectronicsNegative ResistsPhotoresists

01 /Applications

Photolithography

Negative photoresist I is employed in photolithography for the high-resolution patterning of semiconductor wafers and microelectronic devices. Exposed areas cure and become resistant to developing agents, defining circuit patterns.

Microfabrication

This photoresist is integral to microfabrication processes, enabling the creation of micro-scale features for integrated circuits, MEMS, and other microelectronic components.

Pattern Transfer

It serves as a crucial material for transferring complex designs from a photomask to a substrate, facilitating the precise definition of circuit layouts.

Materials Science Research

Researchers in materials science utilize negative photoresist I for developing advanced materials and exploring novel patterning techniques in micro- and nanotechnology.

02 /Properties

Boiling point	122-142 °C(lit.)
Density	0.89 g/mL at 25 °C(lit.)
Viscosity	465-535 cP(25 °C)
Storage temperature	2-8°C

03 /Safety & handling

GHS hazard pictogram: Flammable (GHS02) — Flammable

GHS hazard pictogram: Harmful / irritant (GHS07) — Harmful / irritant

GHS hazard pictogram: Health hazard (GHS08) — Health hazard

Danger

Hazard statements

H226Flammable liquid and vapour
H312Harmful in contact with skin
H315Causes skin irritation
H332Harmful if inhaled
H360FD

Precautionary statements

P201Obtain special instructions before use
P280Wear protective gloves, clothing and eye/face protection
P308IF exposed or concerned

Protective equipment	Eyeshields, Faceshields, full-face respirator (US), Gloves, multi-purpose combination respirator cartridge (US), type ABEK (EN14387) respirator filter
Flash point	24 °C / 75.2 °F
Transport (UN / ADR)	UN 1307 3 / PGIII
Water hazard class (WGK, DE)	3
Hazard codes (EU)	T
Risk statements (R)	60-61-10-20/21-38
Safety statements (S)	53-36/37-45

Hazard information is provided for guidance. Always consult the product Safety Data Sheet (SDS), available on request, before handling.

04 /Identifiers & registry

CAS number

9003-31-0

MDL number

MFCD00084438

05 /Additional specifications

Absorption	UV absorption 310-480 nm

06 /Quality & supply

Documentation

Every batch ships with a Certificate of Analysis covering assay, identity and purity; the grade is confirmed against your enquiry. Safety Data Sheets and technical data sheets are available on request.

Supply & logistics

Samples for technical evaluation; bulk MOQ by grade and packaging. In-stock material ships in 7–10 working days, worldwide, with full export documentation.

07 /Frequently asked questions

What is Negative Photoresist I used for?

Negative Photoresist I is primarily used in photolithography and microfabrication processes to create intricate patterns on substrates for microelectronic devices and circuits. Exposed areas become insoluble, allowing for precise pattern definition.

What is the CAS number and formula for Negative Photoresist I?

The CAS number for Negative Photoresist I is 9003-31-0. The chemical formula is not specified in the provided data.

What grade and purity does Tech Serve Solutions supply?

Tech Serve Solutions supplies Negative Photoresist I, with specifications including a density of 0.89 g/mL at 25°C and viscosity of 465-535 cP at 25°C. TSS does not represent this product as USP, BP, or EP grade.

What are the safety considerations when handling Negative Photoresist I?

Negative Photoresist I is classified as Danger, with hazards including H226 (flammable liquid and vapour), H312 (harmful in contact with skin), H315 (causes skin irritation), H332 (harmful if inhaled), and H360FD (may damage fertility or the unborn child). Appropriate personal protective equipment, including eyeshields, face shields, and respiratory protection, is essential. Handle in a well-ventilated area.

How is Negative Photoresist I packed and shipped?

Negative Photoresist I is shipped as UN 1307, Class 3, Packing Group III, indicating it is a flammable liquid. Specific packing details can be confirmed upon order.

How can I request a sample or quote for Negative Photoresist I?

To request a sample or a quote for Negative Photoresist I, please contact our sales department through the website or via direct inquiry, providing your specific requirements.