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Copper bis(2,2,6,6-tetramethyl-3,5-heptanedionate)

CAS 14040-05-2C22H38CuO4Micro / NanoElectronics

Copper bis(2,2,6,6-tetramethyl-3,5-heptanedionate) (CAS: 14040-05-2) is an organometallic compound with the linear formula Cu(OCC(CH3)3CHCOC(CH3)3)2 and a molecular weight of 430.08. It is a high-purity copper precursor utilised in advanced materials science and microelectronics for thin-film deposition processes. Its properties make it suitable for Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) applications, contributing to the development of novel electronic devices.

IUPAC
2,2,6,6-Tetramethyl-3,5-heptanedione copper(II) derivative,Cu(TMHD)2
Synonyms
6-tetramethyl-3,5-heptanedionate),14040-05-2, Cu(OCC(CH3)3CHCOC(CH3)3)2,2,2,6,6-Tetramethyl-3,5-heptanedione copper(II) derivative,Cu(TMHD)2
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Copper bis(2,2,6,6-tetramethyl-3,5-heptanedionate) (C22H38CuO4) — chemical structure, CAS 14040-05-2; Materials Science, fine chemical supplied by Tech Serve Solutions
CopperMaterials ScienceMicro/NanoElectronicsVapor Deposition Precursors
01 /Applications

CVD and ALD Precursor

Copper bis(2,2,6,6-tetramethyl-3,5-heptanedionate) serves as a crucial precursor in Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) techniques. It enables the precise deposition of copper thin films, essential for microelectronic interconnects and conductive layers in semiconductor manufacturing.

Materials Science Research

This compound is employed in materials science research for the synthesis of novel copper-containing materials and thin films. Its controlled decomposition characteristics allow for tailored material properties and structures in advanced research applications.

Microelectronics Fabrication

In microelectronics, the compound facilitates the fabrication of integrated circuits and advanced electronic components. The copper films deposited using this precursor are vital for creating high-performance and miniaturised devices.

02 /Properties
Molecular weight430.08
Linear formulaCu(OCC(CH3)3CHCOC(CH3)3)2
Assay99%
Melting point198 °C (dec.)(lit.)
03 /Safety & handling
GHS hazard pictogram: Harmful / irritant (GHS07)
Harmful / irritant
Warning

Hazard statements

  • H315Causes skin irritation
  • H319Causes serious eye irritation
  • H335May cause respiratory irritation

Precautionary statements

  • P261Avoid breathing dust, fume, gas or vapours
  • P305IF IN EYES
Protective equipmentdust mask type N95 (US), Eyeshields, Gloves
Water hazard class (WGK, DE)3
Hazard codes (EU)Xi
Risk statements (R)36/37/38
Safety statements (S)26-37/39

Hazard information is provided for guidance. Always consult the product Safety Data Sheet (SDS), available on request, before handling.

04 /Identifiers & registry
CAS number
14040-05-2
MDL number
MFCD00058920
PubChem substance
24861293
05 /Quality & supply

Documentation

Every batch ships with a Certificate of Analysis covering assay, identity and purity; the grade is confirmed against your enquiry. Safety Data Sheets and technical data sheets are available on request.

Supply & logistics

Samples for technical evaluation; bulk MOQ by grade and packaging. In-stock material ships in 7–10 working days, worldwide, with full export documentation.

06 /Frequently asked questions

What is Copper bis(2,2,6,6-tetramethyl-3,5-heptanedionate) used for?

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Copper bis(2,2,6,6-tetramethyl-3,5-heptanedionate) is primarily used as a precursor in Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) for creating copper thin films, particularly in microelectronics and materials science.

What are the CAS number and formula for this compound?

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The CAS number is 14040-05-2, and its linear formula is Cu(OCC(CH3)3CHCOC(CH3)3)2.

What grade and purity does Tech Serve Solutions supply?

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Tech Serve Solutions supplies this compound with an assay of 99% purity. We do not represent this product as USP, BP, or EP grade.

What are the primary hazards associated with this chemical?

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This compound is a Warning substance, indicated by GHS07. It causes skin irritation (H315), serious eye irritation (H319), and may cause respiratory irritation (H335). Appropriate personal protective equipment, including a dust mask (type N95 US), eyeshields, and gloves, should be used.

How is this chemical packed and exported by TSS?

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Tech Serve Solutions reliably packs and exports this chemical globally, adhering to all necessary regulations for safe transport and handling of chemical substances.

How can I request a sample or quote for this product?

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To request a sample or a detailed quote, please contact our sales department via the website or direct inquiry. Our team will promptly assist you with your requirements.

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